Method for placing a component on a substrate
US9009957B2 · kind B2 · utility
0Cited by
18References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 13, 2012 |
| Grant date | Apr 21, 2015 |
| Priority date | — |
| Expiry date | Feb 14, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53191
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method is provided for placing a component on a substrate. The method uses a component feeding device and a component pick-and-place device to place a component on a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.