Systems and methods for encapsulating electronics in a mountable device
US9009958B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 23, 2013 |
| Grant date | Apr 21, 2015 |
| Priority date | — |
| Expiry date | Sep 23, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49163
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A mountable device includes a bio-compatible structure embedded in a polymer that defines at least one mounting surface. The bio-compatible structure includes an electronic component having electrical contacts, sensor electrodes, and electrical interconnects between the sensor electrodes and the electrical contacts. The bio-compatible structure is fabricated such that it is fully encapsulated by a bio-compatible material, except for the sensor electrodes. In the fabrication, the electronic component is positioned on a first layer of bio-compatible material and a second layer of bio-compatible material is formed over the first layer of bio-compatible material and the electronic component. The electrical contacts are exposed by removing a portion of the second layer, a conductive pattern is formed to define the sensor electrodes and electrical interconnects, and a third layer of bio-compatible material is formed over the conductive pattern. The sensor electrodes are exposed by removing a portion of the third layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.