Material deposition system and method for depositing materials on a substrate
US9010910B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2014 |
| Grant date | Apr 21, 2015 |
| Priority date | — |
| Expiry date | Nov 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/11
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A material deposition system includes a frame, a support coupled to the frame to support an electronic substrate during a deposit operation, a gantry coupled to the frame, and a deposition head coupled to the gantry. The deposition head is movable over the support by movement of the gantry. The deposition head includes a chamber to hold material, an actuator to push a volume of material out of the chamber, a needle extending from the chamber and terminating in a needle orifice, and at least two air jets located on opposite sides of the needle orifice. A desired volume of material is formed at the needle orifice in response to the actuator, and each of the at least two air jets produce a timed pulse of air to create a micro-droplet from the desired volume and to accelerate the micro-droplet to high velocity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.