Patent · US Active

Packaged device exposed to environmental air and liquids and manufacturing method thereof

US9011776B2 · kind B2 · utility

5Cited by

5References

22Claims

0Family size

Assignee

STMicroelectronics SA

Inventors

Federico Giovanni Ziglioli · Pozzo d'Adda, IT
Fulvio Vittorio Fontana · Monza, IT
Luca Maggi · Garlate, IT

Key dates

Filing date	Aug 29, 2013
Grant date	Apr 21, 2015
Priority date	—
Expiry date	Aug 29, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH04R2201/003
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A packaged device, wherein at least one sensitive portion of a chip is enclosed in a chamber formed by a package. The package has an air-permeable area having a plurality of holes and a liquid-repellent structure so as to enable passage of air between an external environment and the chamber and block the passage of liquids.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.