Multi-layer assembly with retention feature
US9012006B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2010 |
| Grant date | Apr 21, 2015 |
| Priority date | — |
| Expiry date | May 2, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2991
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multi-layer assembly, such as a sound damping metal laminate used in the automotive industry, having first and second rigid layers and an adhesive layer in between. A retention feature in the form of a raised embossment may be formed in one or more of the rigid layers and may be located near a fastening hole, which accommodates a nut and bolt or some other type of fastening device. The retention feature may impart rigidity and improved stiffness to the multi-layer assembly in the area surrounding the fastening hole, and it may also create a space between the rigid layers that is generally devoid of adhesive from the adhesive layer. This, in turn, can improve the long term performance of the multi-layer assembly by addressing issues such as compression set, spring back and/or stress relaxation. Methods of manufacture and other embodiments are also provided, including ones that accommodate multiple fastening holes, have discontinuous retention features, and use welds in place of nuts and bolts, to name a few.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.