Method of bonding panels of dissimilar material and bonded structure
US9012029B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2012 |
| Grant date | Apr 21, 2015 |
| Priority date | — |
| Expiry date | Mar 10, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24826
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of bonding a first panel made of a first material to a second panel made of a second material is provided. The method includes creating a second panel hole in the second panel at a weld location. An insert composed of the first material is inserted into the second panel hole in the second panel. At least a portion of the insert is fittable in the second panel hole and sized to correspond to the second panel hole. The first panel and the insert are welded together at the weld location, thereby bonding the first and second panels. In one embodiment, the first and second panels are placed between the first and second electrodes of a welding gun. A force is applied to clamp the insert and the first panel between the first and second electrodes and a welding current is delivered. A bonded structure is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.