MEMS package
US9012255B1 · kind B1 · utility
1Cited by
3References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 23, 2013 |
| Grant date | Apr 21, 2015 |
| Priority date | — |
| Expiry date | Oct 23, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0163
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of manufacturing a MEMS package includes initially providing a substrate formed of a first material and defining a bore therein. The bore is substantially completely lined with a second material that is different from the first material. A micromachined component having a fluid passageway formed therein is affixed to the substrate such that the bore and the fluid passageway are in fluid communication.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.