Polyamide composition for surface-mounted components
US9012544B2 · kind B2 · utility
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8References
15Claims
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Key dates
| Filing date | Jun 21, 2011 |
| Grant date | Apr 21, 2015 |
| Priority date | — |
| Expiry date | Jun 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/341
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide composition for surface-mounted components is described. Also described are compositions for surface-mounted components (SMCs) including a semiaromatic polyamide modified by a hydroxyaromatic compound, reinforcing fillers, and a flame retardant. Further, the compositions have many advantages linked to the uses thereof in lead-free reflow soldering processes, in particular a good dimensional stability and a blistering resistance during the use of articles produced from these compositions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.