Device and method for removing tested semiconductor components

US9014841B2 · kind B2 · utility

Assignee

• Multitest Elektronische Systeme GmbH · DE

Inventors

• Thomas Hofmann · San Diego, US
• Klaas Akkermann · Rosenheim, DE
• Stefan Kurz · Frankfurt, DE
• Andreas Nagy · Munich, DE
• Johann Pötzinger · Fischbachau, DE
• Bernhard Lorenz · Marzling, DE

Key dates

• Filing date: Jun 10, 2013
• Grant date: Apr 21, 2015
• Expiry date: Jun 10, 2033

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/2893
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A device for removing tested semiconductor components from a clamping carrier having fixed stop elements and movable clamping elements, pre-tensioned by spring elements includes an actuation device arranged above the clamping carrier, which moves the clamping elements into an opening position enabling the clamping carrier to be discharged, and then moves the clamping elements into a rest position after discharge, an intermediate carrier, positioned under the clamping carrier during discharge, onto which the clamping carrier is emptied, a data memory in which data about each semiconductor component are stored, and a removal device, which removes the semiconductor components from the intermediate carrier and sorts them into at least two different categories in accordance with the data stored in the data memory.