System and method for optimizing a cut location
US9014922B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2012 |
| Grant date | Apr 21, 2015 |
| Priority date | — |
| Expiry date | Jul 11, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B15/02
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A system for determining a cut location at a work surface includes a position sensor and a controller. The controller stores a desired operating parameter and a final design plane of the work surface and determines an actual profile of the work surface. The controller determines a plurality of target profiles corresponding to different cut locations. The target profiles are based at least in part upon the cut location, a loading profile, slot parameters, and the actual profile of the work surface. The controller further determines an optimized target profile relative to the desired operating parameter and the optimized target profile defines an optimized cut location.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.