Method of forming a microchannel cooled component
US9015944B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 22, 2013 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Jan 19, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49906
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming a microchannel cooled component is provided. The method includes forming at least one microchannel within a surface of a relatively planar plate. The method also includes placing a relatively planar cover member over the surface having the at least one microchannel formed therein. The method further includes adhering the relatively planar cover member to the relatively planar plate. The method yet further includes curving the microchannel cooled component by pressing the relatively planar cover member with a forming component for at least a portion of a time period of adhering the relatively planar cover member to the relatively planar plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.