Patent · US Active

Method for manufacturing a data carrier body for a portable data carrier and data carrier body

US9016590B2 · kind B2 · utility

2Cited by

11References

10Claims

0Family size

Assignee

GIESECKE & DEVRIENT GMBH · DE

Inventors

Thomas Tarantino · Laufen, DE
Walter Ponikwar · Burghausen, DE
Tobias Salzer · Unterhaching, DE
Günter Endres · Birkenfeld, DE
Cristina Schellenberger · Garching bei München, DE

Key dates

Filing date	Jun 16, 2011
Grant date	Apr 28, 2015
Priority date	—
Expiry date	Jul 10, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldComputer technology
WIPO sectorElectrical engineering

Abstract

A method for producing a data storage medium body for a portable data storage medium having a core layer and at least one top layer, wherein the core layer contains a chip module. The chip module has a surface which is adverse to lamination and has an adhesive deposit applied on the module surface; a recess is provided in the core layer and the chip module is inserted into the recess such that the module surface having the adhesive deposit is situated towards the open side of the recess; a top layer is applied over the module surface; then the above arrangement is laminated. The adhesive deposit combines intimately with the adjoining top layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.