Bonded patches with bond line control
US9017499B2 · kind B2 · utility
6Cited by
28References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2009 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Nov 6, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/28
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A patch is used to rework an area of a structure. The patch is bonded to the structure by a layer of adhesive. A spacer placed between the patch and the structure is used to control the thickness of the adhesive and/or a bondline.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.