Hot melt adhesive composition for bonding WPP substrates
US9017783B2 · kind B2 · utility
0Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2007 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Oct 13, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31938
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a hot melt adhesive composition including an amorphous poly-alpha-olefin, an amorphous propylene/butene copolymer, a grafted polyethylene, and a wax. The hot melt adhesive composition can be used for bonding woven polypropylene substrates. The invention also provides an adhesive bonded woven polypropylene bag.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.