Patent · US Active

Composite thermal interface material system and method using nano-scale components

US9017808B2 · kind B2 · utility

8Cited by
3References
29Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 12, 2009
Grant dateApr 28, 2015
Priority date
Expiry dateOct 16, 2033

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/31678
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method of manufacturing a thermal interface material, comprising providing a sheet comprising nano-scale fibers, the sheet having at least one exposed surface; and stabilizing the fibers with a stabilizing material disposed in at least a portion of a void space between the fibers in the sheet. The fibers may be CNT's or metallic nano-wires. Stabilizing may include infiltrating the fibers with a polymerizable material. The polymerizable material may be mixed with nano- or micro-particles. The composite system may include two films, with the fibers in between, to create a sandwich. Each capping film may include two sub films: a palladium film closer to the stabilizing material to improve adhesion; and a nano-particle film for contact with a device to be cooled or a heat sink.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.