Patent · US Active

Method of encapsulating a micro-device by anodic bonding

US9018043B2 · kind B2 · utility

0Cited by

4References

10Claims

0Family size

Assignee

COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES · FR

Inventor

Stephane Nicolas · Senlis, FR

Key dates

Filing date	Mar 6, 2014
Grant date	Apr 28, 2015
Priority date	—
Expiry date	Mar 6, 2034

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/031
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for encapsulating at least one micro-device, comprising at least the following steps:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.