Low-density molding compound
US9018280B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2010 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Apr 21, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2996
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A molding composition formulation includes a thermoset cross-linkable 12 to 45 micron polymeric resin. Hollow glass microspheroids are present from 2 to 12 total weight percent. An article formed from such a composition is further strengthened by the addition of a surface activating agent bonded to the surface of the glass microspheroids. Conventional particulate fillers when added to an inventive formulation provide enhanced performance when the filler particle has a size sufficiently small to insert within adjacent microspheroid interstitial voids. An unsaturated polyester resin so formed is particularly well suited for the formation of sheet molding compound formulations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.