Heat-stabilized polyamide composition
US9018292B2 · kind B2 · utility
3Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2011 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Sep 28, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L51/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A polyamide composition is described that is stabilized with respect to heat. The composition can have a polyhydric alcohol-based stabilization system that is excellent in maintaining mechanical properties after exposure to heat. Also described, is a process for producing these compositions, and the use of these compositions for making various articles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.