Polyamide-imide copolymer film and method of preparing polyamide-imide copolymer
US9018343B2 · kind B2 · utility
16Cited by
3References
6Claims
0Family size
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Key dates
| Filing date | Sep 27, 2012 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Sep 27, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/133723
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed herein is a polyamide-imide copolymer film, comprising a copolymer resin in which a unit structure derived from TFDB (2,2′-bistrifluoromethyl-4,4′-biphenyl diamine), a unit structure derived from 6FDA (4,4′-(hexa-fluoroisopropylidene)diphthalic anhydride), a unit structure derived from BPDA (3,3′,4,4′-biphenyltetracarboxylic dianhydride) and a unit structure derived from TPC (terephthaloyl chloride or 1,4-benzenedicarbonyl chloride) are copolymerized, wherein the copolymer resin has a weight average molecular weight of 10,000˜400,000.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.