Printed circuit board and method for manufacturing the same
US9018539B2 · kind B2 · utility
2Cited by
1References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 4, 2012 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Nov 29, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a printed circuit board including: a first circuit pattern formed on a first insulator; a second insulator formed on the first insulator; a second circuit pattern having a pad of which a portion is embedded in the second insulator and a via which penetrates the second insulator to electrically connect the first circuit pattern and the pad; and a third circuit pattern formed on the second insulator, and it is possible to reduce a size of the via without increasing an aspect ratio.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.