Laser material processing system
US9018562B2 · kind B2 · utility
16Cited by
147References
55Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 9, 2007 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Sep 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/0057
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser material processing system and method are provided. A further aspect of the present invention employs a laser for micromachining. In another aspect of the present invention, the system uses a hollow waveguide. In another aspect of the present invention, a laser beam pulse is given broad bandwidth for workpiece modification.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.