Optoelectronic component and method for producing an optoelectronic component

US9018661B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Markus Pindl · Tegernheim, DE
• Simon Jerebic · Regensburg, DE
• Tobias Gebuhr · Regensburg, DE

Key dates

• Filing date: Jan 19, 2012
• Grant date: Apr 28, 2015
• Expiry date: Jan 19, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/855

Abstract

An optoelectronic component includes a substrate, a semiconductor chip arranged on the substrate, and a light-transmissive cover, wherein the light-transmissive cover covers at least an area of the semiconductor chip facing away from the substrate, the light-transmissive cover has a hardness greater than that of silicone, and a connecting material is arranged as a potting material between the light-transmissive cover and the substrate such that those areas of the semiconductor chip not covered by the substrate are surrounded by the connecting material, and the connecting material forms a cavity seal.