Joint structure and semiconductor device storage package
US9018755B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2014 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Apr 8, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16315
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A joint structure includes: a ceramic member; a metallized layer formed on a surface of the ceramic member; and a metal member joined to the metallized layer via a brazing material. The metal member includes a base part erected on the metallized layer, and an extended part extended from the base part to define a predetermined gap with respect to the metallized layer. The base part includes an end joined to the metallized layer by a brazing material layer including the brazing material, and a side joined to the metallized layer around the base part by a fillet including the brazing material formed on the metallized layer around the base part. The extended part defines a recess at a position facing the metallized layer on which the fillet is formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.