Pattern inspection method of semiconductor device optical image
US9021406B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 10, 2014 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | Apr 10, 2034 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/956
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
In accordance with one aspect of this invention, a pattern inspection method includes acquiring optical images regarding figure patterns arranged in each of frame regions, for each of the plurality of frame regions; measuring linewidth dimensions of the figure patterns, for each of the frame regions; operating an average value of each linewidth dimension shift between linewidth dimensions of figure patterns in a reference image corresponding to the frame region concerned and the linewidth dimensions of the figure patterns in the optical image, for each of the frame regions; extracting a specific frame from the frame regions by comparing the average value of the frame region concerned, with average values of frame regions around the frame region concerned, for each of the frame regions; and inspecting the specific frame for dimensional defects of linewidth dimensions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.