Characterizing TSV structures in a semiconductor chip stack
US9021411B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2013 |
| Grant date | Apr 28, 2015 |
| Priority date | — |
| Expiry date | May 23, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/398
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A first signal is transmitted through a first path. A computing device determines a signal propagation time of the first signal. The computing device transmits a second signal through a second path, wherein the second path includes the second signal traversing across at least one interconnecting structure. The computing device determines a signal propagation time of the second signal. The computing device determines a propagation time difference between the signal propagation time of the first signal and the signal propagation time of the second signal. The computing device adjusts a clock based on the determined propagation time difference.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.