Method of fabricating a slip ring component
US9021684B2 · kind B2 · utility
992Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2011 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Oct 23, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49204
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process of fabricating a slip ring component, a slip ring component, and a slip ring assembly are disclosed. The process includes forming a first shot, forming a second shot, and immersion bathing the first shot and the second shot. The immersion bathing applies an electrically conductive plating to exposed surfaces of the second shot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.