Thermally loaded, cooled component
US9022726B2 · kind B2 · utility
3Cited by
10References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2011 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Aug 4, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldEngines, pumps, turbines
- WIPO sectorMechanical engineering
Abstract
A thermally loaded, cooled component thermally coupled to a cooling system configured to receive a gaseous cooling introduced in a forced manner from outside that flows through the cooling system so as to absorb and transport heat away from the component as a result of thermal contact with the component. The component includes at least one Helmholtz resonator configured to improve thermal contact between the cooling medium and the component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.