Patent · US Active

Abrasive tool for use as a chemical mechanical planarization pad conditioner

US9022840B2 · kind B2 · utility

4Cited by

112References

22Claims

0Family size

Assignees

SAINT-GOBAIN ABRASIVES, INC. · US
SAINT-GOBAIN ABRASIFS · FR

Inventors

Charles Dinh-Ngoc · Holliston, US
Srinivasan Ramanath · Holden, US
Eric M. Schulz · Worcester, US
Jianhui Wu · Chengdu, CN
Thomas Puthanangady · Shrewsbury, US
Ramanujam Vedantham · Shrewsbury, US
Taewook Hwang · Acton, US

Key dates

Filing date	Nov 20, 2012
Grant date	May 5, 2015
Priority date	—
Expiry date	Nov 20, 2032

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB24B53/12
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

An abrasive tool including a CMP pad conditioner having a substrate including a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major, wherein a first layer of abrasive grains is attached to the first major surface and a second layer of abrasive grains is attached to the second major surface. The conditioner further includes a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.