Thick film silver paste and its use in the manufacture of semiconductor devices
US9023254B2 · kind B2 · utility
3Cited by
5References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2012 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | May 31, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention is directed to an electroconductive silver thick film paste composition comprising Ag, a glass frit and rhodium resinate, Cr2O3 or a mixture thereof all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste composition and a semiconductor device and, in particular, a solar cell comprising such an electrode. The paste is particularly useful for forming a tabbing electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.