Photosensitive resin composition and applications thereof
US9023589B2 · kind B2 · utility
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5Claims
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Key dates
| Filing date | Sep 16, 2013 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Sep 16, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0045
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A photosensitive resin composition includes: an alkali-soluble resin; an o-naphthoquinonediazidesulfonic acid ester; a urethane(meth)acrylate compound having at least six (meth)acryloyl groups in a molecule; and a solvent. A protective film which is formed from the photosensitive resin composition and an element which includes the protective film are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.