Process for encapsulating a microelectronic device comprising injection of noble gas through a material permeable to this noble gas
US9023675B2 · kind B2 · utility
6Cited by
3References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 29, 2014 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Apr 29, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A process for encapsulating a microelectronic device, comprising the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.