Moisture cure hot melt adhesives
US9023946B2 · kind B2 · utility
3Cited by
28References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2012 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Jan 11, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J201/10
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to new improved adhesives for binding books and related articles and the production of such adhesives. In particular, the adhesives have reduced content of monomeric diisocyanates or no monomeric diisocyanate content.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.