Embedded printed circuit board and method for manufacturing same
US9024203B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 27, 2013 |
| Grant date | May 5, 2015 |
| Priority date | — |
| Expiry date | Nov 7, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing an embedded printed circuit board includes the following steps. First, a circuit substrate is provided. The circuit substrate includes a base, a first wiring layer, and a second wiring layer. The first wiring layer includes a number of electrode connection wires. Second, an opening is defined in the circuit substrate. The opening passes through the base and the second wiring layer. Third, an anisotropic conductive film is adhered onto the electrode connection wires in the opening. Fourth, an electrical element including many electrodes is provided. Fifth, the electrical element is arranged in the opening, with the electrodes respectively spatially correspond to the electrode connection wires, and each electrode is electrically connected to the corresponding electrode connection wire through the anisotropic conductive film, thereby obtaining an embedded printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.