Method for producing optoelectronic components, and products produced thereby

US9027237B2 · kind B2 · utility

Assignee

• Schott AG · DE

Inventors

• Edgar Pawlowski · Stadecken-Elsheim, DE
• Ralf Biertuempfel · Mainz, DE
• Bernd Woelfing · Mainz, DE
• Frank Fleissner · Mainz, DE
• Petra Auchter-Krummel · Wörrstadt, DE
• Ulf Brauneck · Groß-Umstadt, DE
• Joseph Hayden · Clarks Summit, US
• Ulrich Fotheringham · Wiesbaden, DE

Key dates

• Filing date: Jul 5, 2007
• Grant date: May 12, 2015
• Expiry date: Aug 6, 2029

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49137
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

A method for producing optoelectronic components, the method comprising the steps of: providing optical components; picking up, by means of a robot arm, the optical components provided; subsequent to picking up the optical components, mounting the optical components directly on a first wafer by means of the robot arm; wherein the first wafer has optoelectronic components attached, and the optical components being positioned individually or in groups relative to the position of the optoelectronic components of the first wafer using the robot arm; and utilizing, as the first wafer, a glass wafer having i) spectrally filtering glass being an infrared filter glass and ii) an infrared filter coating, the glass wafer having a thickness in the range of 50 to 500 micrometers.