Patent · US Active

Method for producing a flexible circuit configuration

US9027240B2 · kind B2 · utility

0Cited by

5References

13Claims

0Family size

Assignee

Cicor Management AG · CH

Inventors

Ernst Feurer · Blaustein, DE
Bruno Holl · Ulm, DE
Alexander Kaiser · Neutraubling, DE
Karin Ruess · Stuttgart, DE

Key dates

Filing date	Oct 1, 2010
Grant date	May 12, 2015
Priority date	—
Expiry date	Sep 11, 2032

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49165
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.