Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system
US9027360B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2011 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Jul 17, 2032 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B21/02
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.