Bonding structure of diaphragm for microspeaker
US9027700B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 19, 2013 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Sep 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R31/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.