Process for production of sintered copper alloy sliding material and sintered copper alloy sliding material
US9028582B2 · kind B2 · utility
0Cited by
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5Claims
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Key dates
| Filing date | Jan 22, 2009 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Jul 4, 2031 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16C2360/42
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Seizure resistance and wear resistance of Cu—Bi—In copper-alloy sliding material are enhanced by forming a soft phase of as pure as possible Bi. Mixed powder of Cu—In cuprous alloy powder and Cu—Bi containing Cu-based alloy powder is used. A sintering condition is set such that Bi moves outside particles of said Cu—Bi containing Cu-based powder and forms a Bi grain-boundary phase free of In, and In diffuses from said Cu—In containing Cu-based powder to said Cu—Bi containing Cu-based powder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.