Copper film-forming composition, and method for producing copper film by using the composition
US9028599B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 6, 2014 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Aug 6, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/08
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Provided is a copper film-forming composition, which is in the form of a solution and can obtain a copper film having sufficient electrical conductivity when heated at a relatively low temperature. This copper film-forming composition contains 0.01 to 3.0 mol/kg of copper formate or its hydrate, 0.01 to 3.0 mol/kg of copper acetate or its hydrate, at least one diol compound selected from a group of diols of formula (1) and diols of formula (1′), a piperidine compound of formula (2), and an organic solvent. When a content of the copper formate or its hydrate is assumed to be 1 mol/kg, the diol compound is contained in a range of 0.1 to 6.0 mol/kg and the piperidine compound is contained in a range of 0.1 to 6.0 mol/kg.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.