Thermosetting resin composition, B-stage heat conductive sheet, and power module
US9029438B2 · kind B2 · utility
1Cited by
8References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2010 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | May 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 μm to 80 μm. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.