Printed circuit board and method of manufacturing the same
US9029708B2 · kind B2 · utility
1Cited by
4References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2011 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Sep 1, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.