Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the same
US9029759B2 · kind B2 · utility
6Cited by
5References
46Claims
0Family size
Assignee
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Key dates
| Filing date | Apr 12, 2012 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Dec 20, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/57
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.