Sealed infrared imagers
US9029773B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 24, 2013 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Mar 2, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J2005/204
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.