Electronic component

US9029901B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Johann Ramchen · Altdorf, DE
• Christina Keith · Neutraubling, DE
• Bert Braune · Völklingen, DE

Key dates

• Filing date: Aug 19, 2011
• Grant date: May 12, 2015
• Expiry date: Aug 19, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/73265

Abstract

An electronic component has a housing body which comprises a semiconductor chip in a recess. The semiconductor chip in the recess is embedded in a casting compound made of a first plastic material having a first glass transition temperature. A cover element made of a second plastic material having a second glass transition temperature is arranged above the recess. The second glass transition temperature is lower than the first glass transition temperature.