Optoelectronic semiconductor device comprising a semiconductor chip, a carrier substrate and a film

US9029902B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Magnus Ahlstedt · Regensburg, DE
• Johann Ramchen · Altdorf, DE

Key dates

• Filing date: Sep 27, 2011
• Grant date: May 12, 2015
• Expiry date: Dec 7, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002

Abstract

A semiconductor device includes a radiation-emitting semiconductor chip, a carrier substrate and a film. The carrier substrate has electrically conductive contact tracks on a top side. The film is arranged on a radiation exit side of the chip, the radiation exit side being remote from the carrier substrate, and on the top side of the carrier substrate and has electrically conductive first conductor tracks. The film has perforations arranged such that the semiconductor chip can be electrically contact-connected to the first contact track of the carrier substrate via the first conductor track of the film.