Light emitting diode package and method of manufacturing the same
US9029903B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 10, 2013 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Jun 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/49107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting diode package including a package body with a cavity, a plurality of light emitting diode (LED) chips in the cavity, a plurality of wires connected to the plurality of LED chips, and a plurality of lead frames in the package body, wherein the lead frames comprise a first lead frame electrically connected to a first electrode of a first LED chip, a second lead frame electrically connected to a second electrode of the first LED chip and a second electrode of a second LED chip, a third lead frame electrically connected to a first electrode of the second LED chip, and fourth lead frame electrically connected to a second electrode of a third LED chip. Further, ends of the lead frames are exposed outside of the package body and penetrate the package body, and the first electrodes are P electrodes and the second electrodes are N electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.