MEMS microphone
US9029963B2 · kind B2 · utility
28Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2013 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Sep 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Mechanical resonating structures, as well as related devices and methods of manufacture. The mechanical resonating structures can be microphones, each including a diaphragm and a piezoelectric stack. The diaphragm can have one or more openings formed therethrough to enable the determination of an acoustic pressure being applied to the diaphragm through signals emitted by the piezoelectric stack.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.