Springy clip type apparatus for fastening power semiconductor
US9030825B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 13, 2012 |
| Grant date | May 12, 2015 |
| Priority date | — |
| Expiry date | Nov 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/42
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to an apparatus for fastening a power semiconductor using an integral springy (elastic) clip, capable of fixing a power semiconductor, such as a diode and a MOSFET, using elasticity of a U-shaped clip by integrally molding the clip onto a housing of a plastic module. The apparatus includes an elastic (springy) clip integrally molded onto a lower surface of the housing and downwardly curved into a U-like shape in a bridge module in which a bridge of the power semiconductor protrudes through a through hole of the housing to be connected to a printed circuit board, whereby the power semiconductor is fixed by a force that the housing presses the power semiconductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.