Laminated forming dies
US9032774B1 · kind B1 · utility
3Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2013 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | Dec 13, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C33/302
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
One aspect of the disclosure relates to a die comprising a primary plate and secondary plates. The secondary plates comprise through weld holes formed along a direction. The through weld holes of adjacent secondary plates do not overlap when viewed in the direction along which the though weld holes are formed. The primary plate is coupled to at least one secondary plate abutting the primary plate by first welds located in the through weld holes. The secondary plates abutting each other are coupled by second welds located in the through weld holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.