Hem flange joint
US9034135B2 · kind B2 · utility
13Cited by
6References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2007 |
| Grant date | May 19, 2015 |
| Priority date | — |
| Expiry date | May 29, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24215
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a method of producing an edging-fold bond. For this purpose use is made more particularly of high-viscosity adhesives. The method features reduced bubble formation within the edging fold and also within the sealant (where present) that seals the edging-fold seam. More particularly the adhesive comprises spacers which further reinforce this effect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.